Socket: AM3 CPU: Phenom II Připraveno pro CPU AM3 Čipset: AMD® RD890+SB850 FSB: až 5200MT/s Paměti 4x DDR3 800/1066/1333/1600*/1800*/2133*(OC), dual chanel, max 16Gb 5x PCI Express 2.0 x16, 1x PCI Express x1, 1x PCI Storage/Raid: - 1x IDE - 1x SATAII, 6x SATAIII - RAID 0/1/5/10 LAN: 2x Gbit LAN... více

Socket: AM3 CPU: Phenom II Připraveno pro CPU AM3 Čipset: AMD® 760G+SB710 FSB: až 2.6GHz Paměti 4x DDR3 800/1066/1333/1600*(OC), dual chanel, max 16Gb 1x PCI Express 2.0 x16, 1x PCI Express x1, 2x PCI Storage/RAID: - 1x IDE - 5x SATA, 1x eSATA - RAID 0/1/0+1/JBOD LAN: 1x Gbit LAN Realtek® RTL ... více

Socket: AM3 CPU: Phenom II Připraveno pro CPU AM3 Čipset: AMD® 890GX+SB850 FSB: až 5200MT/s Paměti 4 x DDR3 800/1066/1333/1600*/1800*/2133*(OC), dual chanel, max 16Gb 2x PCI Express 2.0 x16, 2x PCI Express x1, 2x PCI Storage/Raid: - 1x IDE - 5x SATAIII - RAID 0/1/5/10 LAN: 1x Gbit LAN Realtek 8... více

Specifikace: CPU (Max Support) Phenom II AM3 CPU Ready Y FSB / Hyper Transport Bus up to 5200MT/s Chipset AMD® 880G+SB850 DDR2 Memory N/A DDR3 Memory DDR3 800/1066/1333 Memory Channel Dual DIMM Slots 2 Max Memory (GB) 16 PCI-Ex16 1 PCI-E Gen Gen2 (1x16) PCI-Ex4 N/A PCI-Ex1 1 PCI 1 IDE N/A SATAIII ... více

Podporované procesory: Model: AMD Phenom II X6/X4/X3/X2, Athlon II X4/X3/X2, Sempron Patice: AM3 Čipová sada: Severní můstek: AMD 880G Jižní můstek: AMD SB850 FSB: Až 5200 MT/s HyperTransport 3.0 Operační paměť: Typ: DDR3 Slot: 4x DIMM Frekvence: 800/1066/1333/1600 MHz Režim zapojen... více

* formát uATX * socket LGA 1156 * kompatiobilní CPU - * 4 x DDR3 1333/1066 MHz * Intel® H57 Express Chipset * integrovaná grafika Intel® HD Graphics * výstupy HDMI, DVI-I * Intel® High Definition Audio 10-chann... více

Základní deska Intel® DH55TC je založena na čipsetu Intel® H55 Express a formátu uATX. Nabízí nadstandardní funkce, jako podpora dual-channel DDR3-1333 paměti se čtyřmi sloty až pro 16GB, Intel® High Definition Audio s prostorovým zvukem 5.1 a integrovanou síťovou kartou Intel® PR... více

Základní deska Intel DH55TC je založena na čipsetu Intel H55 Express a formátu uATX. Nabízí nadstandardní funkce, jako podpora dual-channel DDR3-1333 paměti se čtyřmi sloty až pro 16GB, Intel High Definition Audio s prostorovým zvukem 5.1 a integrovanou síťovou kartou Intel PRO 10/10... více

* socket: LGA1156 * CPU: Core™ i7 Processor/Core™ i5 Processor, podporuje Intel® Turbo Boost Technology * čipset: Intel P55 Express Chipset * paměti: Dual Channel 4x DDR3 2200(O.C.)*/1600/1333 Non-ECC, Un-buffered Memory,max. 16GB, Dual Channel * 2x PCI Express 2.0 x16 (1x16 nebo v dualx8... více

* socket: LGA1156 * CPU: Core™ i7 Processor/Core™ i5 Processor a Processor/Core™ i3, podporuje Intel® Turbo Boost Technology * čipset: Intel P55 Express Chipset * paměti: Dual Channel 4x DDR3 2200(O.C.)*/1600/1333/1066 Non-ECC, Un-buffered Memory, max. 16GB, Dual Channel * 1x PCI Expre... více

* socket: LGA1156 * čipset: Intel® P55 Express Chipset * paměti: 4 x DIMM, Max. 16 GB, DDR3 2133(O.C.)*/2000(O.C.)/1600/1333/1066 Non-ECC,Un-buffered * storage/RAID: Intel® P55 Express Chipset built-in, 6 xSATA 3.0 Gb/s porty, Intel Matrix Storage, Technology Podpora RAID 0,1,5,10, JMicron... více

* socket: LGA1156 * čipset: Intel® P55 Express Chipset * paměti: 4 x DIMM, Max. 16 GB, DDR3 2200(O.C.)*/1600/1333/1066 Non-ECC,Un-buffered, architektura paměti Dual Channel * storage/RAID: 6 xSATA 3.0 Gb/s porty, Intel Matrix Storage Technology Podpora RAID 0,1,5,10, 1 x Ultra DMA 133/100/6... více

* socket: LGA1156 * čipset: Intel® P55 Express Chipset * paměti: 4 x DIMM, Max. 16 GB, DDR3 2200(O.C.)*/1600/1333/1066 Non-ECC,Un-buffered, Architektura paměti Dual Channel * storage/RAID: 6 xSATA 3.0 Gb/s porty, Intel Matrix Storage Technology Podpora RAID 0,1,5,10, 1 xExternal SATA 3Gb/s ... více

Chipset - Intel® Q57 Revize - 1.0 Rozměrový formát - mATX (244 mm x 232 mm) Patice procesoru - socket - LGA 1156 Podpora pro procesory - Intel® Core™ i7 / Intel® Core™ i5 / Intel® Core™ i3 procesor Sloty pro paměti - 4 Podpora pro paměti - DDR3 1666 (OC)/1333/1066/800 MHz (dual cha... více

*CPU Supports Intel® i3 / i5 / i7 based processors in LGA1156 package. Please refer to CPU Support for compatible CPU; the above description is for reference only. *Chipset - Intel® H55 Chipset - Supports QPI up to 6.4GT/s - Hi-Speed USB (USB2.0) controller, 480Mb/sec. - 6 SATAII ports with tran... více

* Board Form Factor - microATX * Socket - LGA1155 * Memory Specifications - * Max Memory Size - 32 GB * (dependent on memory type) - * Memory Types - DDR3-1066/1333 * # of Memory Channels - 2 * # of DIMMs - 4 * Graphics Specifications - * Graphics Output - DVI-I+HDMI * Intel® Clear Video ... více

* Board Form Factor - microATX * Socket - LGA 1155 * Memory Specifications - * Max Memory Size - 32 GB * (dependent on memory type) - * Memory Types - DDR3-1333 * # of Memory Channels - 2 * # of DIMMs - 4 * Graphics Specifications - * Integrated Graphics - No * Graphics Output - N/A * Dis... více

* Board Form Factor - MicroATX * Socket - LGA 1155 * Memory Specifications - * Max Memory Size - 32 GB * (dependent on memory type) - * Memory Types - DDR3-1333 * # of Memory Channels - 2 * # of DIMMs - 4 * Graphics Specifications - * Graphics Output - VGA+DVI-D * Intel® Clear Video Techn... více

* Board Form Factor - microATX * Socket - LGA 1155 * Memory Specifications - * Max Memory Size - 32 GB * (dependent on memory type) - * Memory Types - DDR3-1333 * # of Memory Channels - 2 * # of DIMMs - 4 * Graphics Specifications - * Graphics Output - DVI-I+HDMI * Intel® Clear Video Tech... více

* Board Form Factor - ATX * Socket - LGA 1155 * Embedded Options Available - No * - * Supplemental SKU - No * Max TDP - 95 W * Memory Specifications - * Max Memory Size - 32 GB * (dependent on memory type) - * Memory Types - DDR3-1333 * # of Memory Channels - 2 * # of DIMMs - 4 * Graphi... více

* Board Form Factor - Micro-ATX * Socket - LGA1155 * Extended Life Program (XLP) - Yes * Max TDP - 95 W * Memory Specifications - * Max Memory Size - 32 GB * (dependent on memory type) - * Memory Types - DDR3-1066/1333 * # of Memory Channels - 2 * # of DIMMs - 4 * ECC Memory Supported - No... více

* Board Form Factor - Micro ATX * Socket - LGA1155 * Extended Life Program (XLP) - Yes * Max TDP - 95 W * 12V DC Input Capable - No * Back-to-BIOS Button - No * Memory Specifications - * Max Memory Size - 32 GB * (dependent on memory type) - * Memory Types - DDR3-1066/1333 * # of Memory Ch... více

* Board Form Factor - ATX * Socket - LGA 1155 * Memory Specifications - * Max Memory Size - 32 GB * (dependent on memory type) - * Memory Types - DDR3-1333 * # of Memory Channels - 2 * # of DIMMs - 4 * Graphics Specifications - * Graphics Output - DVI-I+HDMI * Intel® Clear Video Technolog... více

* Board Form Factor - ATX * Socket - LGA 1155 * Back-to-BIOS Button - Yes * Memory Specifications - * Memory Types - DDR3 1600+ * # of Memory Channels - 2 * # of DIMMs - 4 * Graphics Specifications - * Discrete Graphics - PCIe x16 or x8/x8 * Expansion Options - * PCI Support - 2 * PCIe x1... více

* Board Form Factor - ATX * Socket - LGA 1155 * Back-to-BIOS Button - Yes * Memory Specifications - * Memory Types - DDR3 1600+ * # of Memory Channels - 2 * # of DIMMs - 4 * Graphics Specifications - * Discrete Graphics - PCIe x16 or x8/x8 * Expansion Options - * PCI Support - 2 * PCIe x1... více